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Name | Expected Completion | Dependencies | Description |
---|---|---|---|
IdP V5 | 2023 | Java 17, Spring 6 | Migration of the IdP platform and dependencies (including OpenSAML) to Java 17 and Spring Framework 6 to keep the platform appropriately current. This will remove some deprecated function but is not focused on new features. This includes getting an official statement from Spring on the expected elimination of Spring WebFlow as a supported project, leaving us to produce our own compatible version of that code going forward. https://jira.spring.io/browse/SWF-1750 |
Second Generation IdP Proxy Support | 2022 | Add sufficient OIDC and possibly CAS support to IdP to handle proxying use cases without additional software footprint. SAML proxying support was added to IdPv4. | |
OIDC/OAuth Enhancements | 2022 | Additional features for the OIDC OP plugin, initially focused on use cases adjacent to OIDC specs, or adding optional OIDC material, and some enhancements to provide some additional OAuth functionality. See JOIDC project in Jira. Specific enhancements will largely depend on member interest/demand. | |
SP Packaging Automation | Ongoing | AWS-based process for automating SP packaging, at least encompassing RPM platforms. This will conincide with changes to the packages we produce. The initial work is completed but work is ongoing to allow for CI in AWS. | |
SP V4 Redesign | 2024-2025 | Substantial design work | The SP is on an unsustainable path and needs to be replaced with a different software redesign that addresses sustainability challenges – see SP4DetailsThis work has begun with preliminary technical work and early planning and design, likely through 2021, with more comprehensive work starting in 2022. Service Provider V4 Redesign |
Planned
Planned projects are work accepted by the Consortium but which are not yet under development due to lack of resources or unmet preconditions. When committed work is complete the individuals working on the completed work will normally pick up a project from this list.
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